How do I get CHIPS Act Funding?
BREAKING NEWS (5/6/24)- $250 million Opportunity for a Digital Twin R&D Institute Announced. Matching Funds are required, concept papers are due June 20:
Contact us here ASAP for a more in-depth discussion.
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The CHIPS Act makes $53 billion available for semiconductor manufacturing and R&D, plus a 25% refundable tax credit for qualified CapEx.
See below to discover where your business fits in
R&D Funding Opportunities
Small Business R&D – CHIPS Metrology
Background
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This is an SBIR (small business innovation research opportunity) via the CHIPS Act
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Funding: Phase I - Up to $280k over 6 months, Phase II: up to $1.9 million over 2 yrs. Applicants must apply for both phases. An additional $100k may be available for commercialization after.
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If you already won an SBIR phase I grant from another agency in a covered topic, you can apply for phase II funding as part of this opportunity.
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Applicants must be small businesses defined here (fewer than 500 employees etc.)
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Be aware the government can own some IP rights when you accept SBIR funding
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Deadline is June 14, 2024
Research Areas (see pp. 80-85 here)
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Metrology for Materials Purity, Properties, and Provenance
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Advanced Metrology for Future Microelectronics Manufacturing
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Enabling Metrology for Integrating Components in Advanced Packaging (e.g. Methods for integrating chiplets, dielets, SoCs, and memories into packages )
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Modeling and Simulating Semiconductor Materials, Designs, and Components
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Modeling and Simulating Semiconductor Manufacturing Processes
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Standardizing New Materials, Processes and Equipment for Microelectronics
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Metrology to Enhance Security and Provenance of Microelectronic-based Components and Product
Additional Specific Research Areas (see pp. 85-99 here)
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Near-Real Time RF Propagation Measurement System
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Compact, fieldable cryogenics for deployment of superconducting-nanowire single-photon detectors in a circuit-evaluation microscope
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Microscope for time-resolved emission microscopy with superconducting-nanowire single-photon detectors
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Device-Scale AFM-Thermoreflectance Hybrid Metrology
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Super-resolution beam scanning, wide bandwidth, optical photothermal infrared (O-PTIR) microscope
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High brightness compact X-ray or EUV sources for semiconductor metrology
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Nanoscale dimensional metrology reference standards to support semiconductor metrology
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Advanced Electron Backscatter Diffraction (EBSD) detector offering high pixel density, high-speed and low noise operation, and low kV detection enabled by directly detecting electrons using an application specific integrated circuit (ASIC) detector.
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TEM High Voltage Biasing Holder
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Wafer-scale ferromagnetic resonance spectrometer for Advanced MRAM Wafer Data and Quality Control
Other Funding Opportunities
I'm a Fab or Packaging Facility
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Register with SAM
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File a statement of interest via the application portal
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File a pre-application based on these requirements. Also see the application materials tab for templates etc.
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Government will advise based on the pre-application whether to pursue a full application
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Need help? Contact our expert grant writing team here.
I'm an Upstream Supplier
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Currently open to wafer manufacturers, and to suppliers of materials or equipment for which the capital investment exceeds $300MM+.
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Register with SAM
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File a statement of interest via the application portal
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File a pre-application based on these requirements on or after Sept. 1. See the "application materials" tab on this website for templates etc.
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For smaller projects (<$300MM) file a 15-page concept plan between Dec. 1 and Feb. 1 consistent with these guidelines
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Need help? Contact our expert grant writing team here
I'm Fabless
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Application details for R&D facilities are starting to be released. In the meantime:
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Register with SAM
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File a statement of interest via the application portal
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Work with local government to line up the required project incentive (e.g., tax break, land concession etc.)
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Need help? Contact our expert grant writing team here.
I'm in Wireless Technology
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The CHIPS Act makes $1.5 billion available for wireless supply chain innovation
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The first tranche is $140MM for Testing and Evaluation
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Round I application details are available here: Notice of Funding Opportunity
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Contact us for more information: equity@chipsact.com
I Just Want the Tax Credit
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The proposed rules for the 25% refundable manufacturing tax credit are available here, here and here.
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Property must be used "used directly in the manufacturing operation" to qualify for the credit.
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Contact us for more information: equity@chipsact.com
I Make PCBs or Packaging
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In addition to CHIPS Act funding, the President has made funds available under Title III of the Defense Production Act.
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Read the press release here and contact us for more information: equity@chipsact.com
I'm an Educational Institution
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Businesses submitting grant proposals must partner with educational entities to provide workforce training, so seek corporate partners.
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The National Science Foundation gets $200MM to promote growth in the semiconductor workforce
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$2 billion is available for a DOD led national network for university-based prototyping, lab-to-fab transition of semiconductor technologies and semiconductor workforce training
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Contact us for more information: equity@chipsact.com
I'm a Startup
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Some of the $11 billion in R&D funding will go toward an investment fund. Details on the size and eligibility are yet to be released.
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Startups should also look to partner with fabs because as part of their application they must show efforts to invest in R&D
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Contact us for more information: equity@chipsact.com
I want to Join a Tech Hub
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Both DOD and the Commerce Department have designated certain areas as Tech Hubs
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Once designated, these Hubs have the opportunity to compete for funding by submitting project proposals featuring participating businesses, academic institutions etc.
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Each Hub has a different focus area (e.g., AI, GaN, quantum etc.). Businesses should contact the Hub most appropriate for them, geographic area usually doesn't matter.
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A list of Commerce Dept. Hubs is here. DOD's Microelectronics Commons HUB list is here.
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The DOD hub funding opportunities are available here.
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The Commerce Hub funding notice is open and available here.
Key Documents
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White paper for the $3 billion National Advanced Packaging Manufacturing Program. The first funding round, focused on substrate materials, will open Q1'24
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Text of The CHIPS Act of 2022 as passed by Congress on 7/28/22 and sent to the President for signature
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Text of the FY21 National Defense Authorization Act, authorizing appropriations for the CHIPS Act program P.L. 116-283 (See sections 9902 and 9906)
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The Commerce Department's National Security Guardrails for CHIPS funding recipients (i.e., rules restricting grantees from doing business with certain foreign countries)
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The Commerce Department's Vision for the National Semiconductor Technology Center and summary fact sheet
Email: equity@chipsact.com